TP1000-H65-9
- Manual Quote
| Thermal conductivity (W/m·K) | 10.0 |
|---|---|
| Thermal conductivity (W/m·K) Test Standard | ISO 22007-2 |
| Density (g/cc) | 3.5 |
| Density (g/cc) Test Standard | ASTM D792 |
| Hardness (Shore 00) | 65 |
| Hardness (Shore 00) Test Standard | ASTM D2240 |
| Operating temperature range (°C) | -40~150 |
| Operating temperature range (°C) Test Standard | IEC 60068-2-14 |
| Color | Gray |
| Color Test Standard | Visual |
| Thickness (mm) | 0.4~5.0 |
| Thickness (mm) Test Standard | ASTM D374 |
| Flammability | V-0 |
| Flammability Test Standard | UL 94 |
| Breakdown voltage (kV/mm) | >6 |
| Breakdown voltage (kV/mm) Test Standard | ASTM D149 |
| Volume resistivity (Ω·cm) | 10 11 |
| Volume resistivity (Ω·cm) Test Standard | ASTM D257 |
| Dielectric constant (1 MHz) | 7.0 |
| Dielectric constant (1 MHz) Test Standard | ASTM D150 |
| TDS datasheet | Download TDS |
| TDS datasheet Test Standard |
Description
Product Introduction
Selling point: 10 W/(m·K) thermal silicone pad. Typical application: weakly-adhesive heat dissipation pad for high-power chips.
